2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound

Product Details
Customization: Available
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  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
  • 2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
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  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Company Profile
  • Certifications
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
VS-TP2001
EINECS
N/a
Bonding Function
Thermal Paste
Morphology
Curing Glue
Application
Automobile, Construction, Packing
Material
Silicone
Classification
Silicone Glue
Main Agent Composition
Inorganic Adhesive Material
Characteristic
Aging Resistance
Promoter Composition
Curing Agent
Composition
Inorganic Material
Color
Gray
Viscosity (After Mixing)@25 Degrees
5500cps
Opening Hours @25 Degrees
More Than 90 Min
Curing Conditions
30min/50 Degrees 20min/100 Degrees
Thermal Conductivity
2.0
Thermal Resistance
0.000815
Hardness
25 Shore a
Density
2.3 g/cm3
Tensile Strength
More Than 0.2 MPa
Elongation at Break
More Than 10%
Flammability Rating
V-0
Breakdown Strength
More Than 10 Kv/mm
Dielectric Constant (1000Hz)
4.7~5.5
Transport Package
Barreled in Carton
Specification
RoHs
Trademark
Volsun
Origin
Jiangsu
HS Code
8547909000
Production Capacity
1, 000, 000 Meters/Month

Packaging & Delivery

Package Size
22.00cm * 22.00cm * 10.00cm
Package Gross Weight
0.300kg

Product Description

 

Product Description

VS-TP2001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
VS-TP2001 is a two-component 1:1 type heat-curing silicone thermally conductive liquid formable gel material that cures at room temperature or after heating to form an elastic thermally conductive silicone rubber, specially designed for the manufacture of electrical and electronic products and modules, such as high Potting protection of power supply modules, frequency converters, sensors, etc., connection and fixation between automotive electronic devices and PCB, etc.

Detailed Photos
2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound
2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound

 

 
Product Parameters

Features

   ♦  Continuous operating temperature:-70ºC~+200ºC
   ♦  Excellent mechanical properties and extensibility
   ♦  Excellent thermal conductivity and aging resistance
   ♦  Low viscosity, self-leveling, excellent drilling ability
   ♦  Low modulus, low stress, good adhesion to both metals and plastics

Technical Performance
Item Typical Data Test Method
Mixing ratio 1:1 /
Color(After mixing) Grey Visual
Viscosity (Component A) @25ºC 5500±500cps ASTM D2196
Viscosity (Component B) @25ºC 5500±500cps ASTM D2196
Viscosity (After mixing) @25ºC 5500±500cps ASTM D2196
Opening hours @25ºC ≥90min /
Curing condition 30min/50ºC;20min/100ºC /
Thermal Conductivity 2.0±0.2 W/m·k ASTM D5470
Thermal resistance 0.000815m2·k/W ASTM D5470
Hardness 25±5 Shore A GB/T 531.1-2008
Density 2.3±0.2 g/cm3 GB/T 1033.1-2008
Tensile strength >0.2 MPa GB/T 528-2009
Elongation at break >10% GB/T 528-2009
Flame retardant rating V-0 UL94
Breakdown strength ≥10 kV/mm GB/T 1695-2005
Volume resistivity ≥  1.0×1014  Ω·cm GB/T 1692-2008
Dielectric constant(1000Hz) 4.7~5.5 GB/T 1693-2007
Dimension
 
Specification Package
VS-TP2001(1kg) Component A: 0.5kg; Component B: 0.5kg
VS-TP2001(20kg) Component A: 10kg; Component B: 10kg
VS-TP2001(40kg) Component A: 20kg; Component B: 20kg
VS-TP2001(80kg) Component A: 40kg; Component B: 40kg
VS-TP2001(100kg) Component A: 50kg; Component B: 50kg
 
  The special sizes & packages are available on request.

 
Company Profile

Suzhou Volsun Electronics Technology Co.,Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions for over 17 years.

Quality is our culture. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc. And we have gained some advanced titles such as Jiangsu famous scientific and technical corporation, China new high-tech enterprise etc. have independent intellectual property rights, 88 patents and 97 product certifications.

Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication,Automobile, Power industry etc.

2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound

Certifications

    2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound

 
 

 

Packaging & Shipping

2.0W Thermal Conductivity High Shear Strength Silicone Gel Potting Compound

 

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