Thermal Conductivity Silicone Thermal Pad for Electronic Devices

Product Details
Customization: Available
Color: Regular Gray
Density (g/cm3): 1.9
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  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
  • Thermal Conductivity Silicone Thermal Pad for Electronic Devices
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  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Company Profile
  • Certifications
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
VS-GP1501
Hardness (Shore Oo)
25~70
Tensile Strength(Kpa)
80
Elongation at Break (%)
50
Thermal Conductivity (W/M·K)
1.5
Flame Retardancy Rating
V-0
Volume Resistivity
1.0 *10^14
Transport Package
Carton
Specification
Customizable
Trademark
Volsun
Origin
Jiangsu
HS Code
8547909000
Production Capacity
1, 000, 000 Meters/Month

Packaging & Delivery

Package Size
22.00cm * 22.00cm * 10.00cm
Package Gross Weight
1.000kg

Product Description

 High Quality 1.5W Heat Dissipation Silicone Thermal Conductive Pad

Product Description

VS-GP1501 silicone thermal pads achieve low interfacial thermal resistance at relatively low pressures, with excellent thermal conductivity, thermal stability, flexibility and resilience. Also, it is safe and reliable to use. Applied between the power device and the cooling aluminum sheet or the machine shell, the air can be effectively excluded to achieve good thermal conductivity and filling effect.

Detailed Photos
Thermal Conductivity Silicone Thermal Pad for Electronic Devices
Thermal Conductivity Silicone Thermal Pad for Electronic Devices
Thermal Conductivity Silicone Thermal Pad for Electronic Devices
Thermal Conductivity Silicone Thermal Pad for Electronic Devices

 

Product Parameters

Features

   ♦  Continuous operating temperature:-40ºC~+200ºC
   ♦  High thermal conductivity, low thermal resistance
   ♦  Excellent surface wettability and resilience
   ♦  Excellent flame retardancy
   ♦  Multiple thickness selection, wide application range
   ♦  Environmental protection standard: RoHS, REACH


Technical Performance
Item Typical Data Test Method
Standard color Grey Visual
Density (g/cm3) 1.9 ASTM D792
Thickness (mm) 0.5~5.0 ASTM D374
Hardness (Shore OO) 25~70 GB/T 531.1-2008
Tensile Strength(KPa) ≥100 GB/T 528-2009
Elongation at break (%) ≥50 GB/T 528-2009
Thermal conductivity (W/m·k) 1.5 ASTM D5470
Flame Retardancy Rating V-0 UL94
Dielectric Breakdown Voltage (kV) >7KV/mm ASTM D149
Volume resistivity ≥1.0×10 14 Ω· ASTM D257
Dimension

Customizable, the sizes & packages are available on request.
 
Company Profile

Suzhou Volsun Electronics Technology Co.,Ltd. was founded in 2006. We keep focusing on the R&D, production and sales in insulation, sealing & protection solutions for over 17 years.

Quality is our culture. Volsun has a modern quality management system, which has passed a series of quality system certification such as IATF16949, ISO9001 etc. And we have gained some advanced titles such as Jiangsu famous scientific and technical corporation, China new high-tech enterprise etc. have independent intellectual property rights, 88 patents and 97 product certifications.

Up to now, Volsun cooperated with customers from 88 countries, we offer suitable sealing, waterproof solutions for some well-know enterprises in communication,Automobile, Power industry etc.

Thermal Conductivity Silicone Thermal Pad for Electronic Devices

Certifications

    Thermal Conductivity Silicone Thermal Pad for Electronic Devices

Packaging & Shipping

Thermal Conductivity Silicone Thermal Pad for Electronic Devices

Thermal Conductivity Silicone Thermal Pad for Electronic Devices
Thermal Conductivity Silicone Thermal Pad for Electronic Devices
Thermal Conductivity Silicone Thermal Pad for Electronic Devices

 

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