Customization: | Available |
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Formula: | Natural Polymer |
Bonding Function: | Instant Adhesive |
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VS-TP1001 Silicone Thermally Conductive Liquid Formable Gel Material Potting Compound
Item | Typical Data | Test Method | |
Mixing ratio | 1:1 | / | |
Color(After mixing) | Grey | Visual | |
Viscosity (Component A) @25ºC | 2500±500cps | ASTM D2196 | |
Viscosity (Component B) @25ºC | 2500±500cps | ASTM D2196 | |
Viscosity (After mixing) @25ºC | 2500±500cps | ASTM D2196 | |
Opening hours @25ºC | ≥60min | / | |
Curing condition | 30min/50ºC;20min/100ºC | / | |
Thermal Conductivity | 1.0±0.2 W/m·k | ASTM D5470 | |
Thermal resistance | 0.000815m2·k/W | ASTM D5470 | |
Hardness | 65±5 Shore A | GB/T 531.1-2008 | |
Density | 2.0±0.2 g/cm3 | GB/T 1033.1-2008 | |
Tensile strength | >0.5 MPa | GB/T 528-2009 | |
Elongation at break | >10% | GB/T 528-2009 | |
Flame retardant rating | V-0 | UL94 | |
Breakdown strength | ≥15 kV/mm | GB/T 1695-2005 | |
Volume resistivity | ≥ 1.0×1014 Ω·cm | GB/T 1692-2008 | |
Dielectric constant(1000Hz) | 3.9~4.6 | GB/T 1693-2007 |
Specification | Package | ||
VS-TP1001(1kg) | Component A: 0.5kg; Component B: 0.5kg | ||
VS-TP1001(20kg) | Component A: 10kg; Component B: 10kg | ||
VS-TP1001(40kg) | Component A: 20kg; Component B: 20kg | ||
VS-TP1001(80kg) | Component A: 40kg; Component B: 40kg | ||
VS-TP1001(100kg) | Component A: 50kg; Component B: 50kg |