| CAS No.: | N/a |
|---|---|
| Formula: | N/a |
| EINECS: | N/a |
| Bonding Function: | Thermal Paste |
| Morphology: | Curing Glue |
| Application: | Automobile, Construction, Packing |
| Samples: |
Potting Compound
|
|---|
| Customization: |
|---|
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